Our Suppliers

Think global, act locally. Drawing from our mission, we have eighteen distribution offices across China to provide an unparalleled level of service to our customers. We work with the very best suppliers from all over the world so we truly understand both sides of the sales cycle. We address challenges in the way we execute; creative solution orientated thinking.

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  • HiSilicon

  • HiSilicon Image
  • HiSilicon is a global leading fabless semiconductor and IC design company that is dedicated to providing comprehensive connectivity and multimedia chipset solutions. As a prominent industry leader, HiSilicon paves the way for innovations in global connectivity and end-to-end ultra-HD video technologies.

    From high-speed communications, smart devices, and IoT to video applications, HiSilicon chipsets and solutions have been proven and certified in more than 100 countries and regions in the world: For wireless communications, technology leadership is a tremendous achievement and it is mainly contributed by the company’s pursuit of innovations. This includes the successful launch of Balong modems with LTE Cat.4, Cat.6, Cat.12/13, Cat.18, Cat.19, Cat.21, dual SIM & dual LTE (with VoLTE), and pseudo-base-station defense technologies ahead of other providers. HiSilicon is the first to commercialize 5G wireless chipsets to promote the 5G industry development.  For smart devices, HiSilicon’s Kirin SoCs provide high-performance, high-power-efficiency, and ultra-intelligent mobile AI solutions to create a superior user experience. For data centers, HiSilicon develops Kunpeng series server CPU processors based on the ARM architecture. With outstanding performance, throughput, integration, and energy efficiency, Kunpeng series processors apply in a wide range of scenarios such as big data, distributed storage, ARM native application, meeting diversified computing requirements of data centers. For AI applications, HiSilicon provides all-scenario AI chipset Ascend series SoC to extend AI from the data center to the edge and device, offering AI computing power towards data center, edge, consumer device and IoT scenarios, also provides brand-new solutions for the innovative use cases such as safety city, self-driving, cloud service, IT intelligence, smart manufacturing, and robots to accelerate the implementation of AI in each domain.

  • CEO:
  • 1991
  • Founded:
  • « Back to Catalog
  • « Back to Catalog
  • HiSilicon

  • HiSilicon Image
  • HiSilicon is a global leading fabless semiconductor and IC design company that is dedicated to providing comprehensive connectivity and multimedia chipset solutions. As a prominent industry leader, HiSilicon paves the way for innovations in global connectivity and end-to-end ultra-HD video technologies.

    From high-speed communications, smart devices, and IoT to video applications, HiSilicon chipsets and solutions have been proven and certified in more than 100 countries and regions in the world: For wireless communications, technology leadership is a tremendous achievement and it is mainly contributed by the company’s pursuit of innovations. This includes the successful launch of Balong modems with LTE Cat.4, Cat.6, Cat.12/13, Cat.18, Cat.19, Cat.21, dual SIM & dual LTE (with VoLTE), and pseudo-base-station defense technologies ahead of other providers. HiSilicon is the first to commercialize 5G wireless chipsets to promote the 5G industry development.  For smart devices, HiSilicon’s Kirin SoCs provide high-performance, high-power-efficiency, and ultra-intelligent mobile AI solutions to create a superior user experience. For data centers, HiSilicon develops Kunpeng series server CPU processors based on the ARM architecture. With outstanding performance, throughput, integration, and energy efficiency, Kunpeng series processors apply in a wide range of scenarios such as big data, distributed storage, ARM native application, meeting diversified computing requirements of data centers. For AI applications, HiSilicon provides all-scenario AI chipset Ascend series SoC to extend AI from the data center to the edge and device, offering AI computing power towards data center, edge, consumer device and IoT scenarios, also provides brand-new solutions for the innovative use cases such as safety city, self-driving, cloud service, IT intelligence, smart manufacturing, and robots to accelerate the implementation of AI in each domain.

  • CEO:
  • 1991
  • Founded:

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